Copper With Silver C10700, Oxygen Free - Plated Wire Supplier

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Copper With Silver C10700, Oxygen Free

COPPER, C10700
Oxygen Free, With Silver

COMPOSITION
COPPER, Oxygen Free, C10700, With Silver

ELEMENT MINIMUM
Copper 99.95%
Silver .085

 

PHYSICAL PROPERTIES
COPPER, Oxygen Free, C10700, With Silver

ENGLISH UNITS

METRIC UNITS

Melting Range

1981°F

1083°C

Density

.323 lb/cu in. @ 68°F

8.94 gm/cm@ 20°C

Specific Gravity

8.94

8.94

Coefficient of Thermal Expansion

.0000098 per °F (68-572°F)

.0000177 per °C (20-300°C)

Thermal Conductivity

224 BTU/sq ft/ft/hr/°F @ 68°F

.927 cal/sq cm/cm/sec/°C @ 20°C

Electrical Resistivity (Annealed)

10.4 Ohms-circ mil/ft @ 68°F

1.72 microhm - cm @ 20°C

Electrical Conductivity (Annealed)

100% Copper IACS @ 68°F

.580 megohm cm @ 20°C

Specific Heat

.092 BTU/lb/°F @ 68°F

.092 cal/gm/°C @ 20°C

Modulus of Elasticity (tension)

17,000 KSI

12,100 kg/sq mm

Modulus of Rigidity (torsion)

6400 KSI

4500 kg/sq mm

Annealing Temperature

900-1400°F

475-750°C

 

MECHANICAL PROPERTIES
COPPER, Oxygen Free, C10700, With Silver

For Round Wire

TEMPER TENSILE STRENGTH

PERCENT ELONGATION

KSI* MPa**
Soft or Annealed 35 241 35 min 10 in.
Hard 55 379 1.5 in 60 in.
Spring 66 455 1.5 in 60 in.

For more details see ASTM B3-63, ASTM B2-52, ASTM B1-56

 

MECHANICAL PROPERTIES
COPPER, Oxygen Free, C10700, With Silver

For Flat Wire

DESIGNATION TENSILE STRENGTH
STD FORMER KSI* MPa*
-- Annealed Soft Grain Size .050 min, nominal --
-- Deep Draw Grain Size .050 min, maximum --
-- Light Rolled 32-40 220-275
-- Half Hard (1/2) 37-46 255-317
H04 Hard (H) 43-52 296-358
H08 Spring 50-58 344-399
H10 Extra Spring 52 min 358 min

For more details see ASTM B152 Strip --
General Tolerances see ASTM 248

* 1 KSI equals 1,000 PSI
** 1 KSI equals 6.894,757 MPa
†† Tensile Strength and Grain Size determining factors.

COPPER, C10700 Oxygen Free, With Silver

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